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Product specification
6
Chip Resistor Surface Mount
RV
SERIES
0805/1206/2512 (RoHS Compliant)
8
TESTS AND REQUIREMENTS
Table 4 Test condition, procedure and requirements
TEST
Life/
Operational Life/
Endurance
High
Temperature
Exposure/
Endurance at
upper category
TEST METHOD
MIL-STD-202G-method 108A
IEC 60115-1 4.25.1
JIS C 5202-7.10
MIL-STD-202G-method 108A
IEC 60115-1 4.25.3
JIS C 5202-7.11
PROCEDURE
1,000 hours at 70±5 °C applied RCWV
1.5 hours on, 0.5 hour off, still air required
1,000 hours at maximum operating temperature
depending on specification, unpowered
No direct impingement of forced air to the parts
Tolerances: 155±3 °C
REQUIREMENTS
±(2%+0.05 ? )
±(1%+0.05 ? )
temperature
Moisture
Resistance
MIL-STD-202G-method 106F
IEC 60115-1 4.24.2
Each temperature / humidity cycle is defined at 8
hours (method 106F), 3 cycles / 24 hours for 10d
±(2%+0.05 ? )
with 25 °C / 65 °C 95% R.H, without steps 7a &
7b, unpowered
Parts mounted on test-boards, without
condensation on parts
Measurement at 24±2 hours after
test conclusion
Thermal Shock
MIL-STD-202G-method 107G
-55/+155 °C
Note: Number of cycles required is 300. Devices
unmounted
±(0.5%+0.05 ? ) for 10 K ? to
10 M ?
±(1%+0.05 ? ) for others
Maximum transfer time is 20 seconds. Dwell time
is 15 minutes. Air – Air
Short time
overload
Board Flex/
Bending
MIL-R-55342D-para 4.7.5
IEC60115-1 4.13
IEC60115-14.33
2.5 times RCWV or maximum overload voltage
whichever is less for 5 sec at room temperature
Device mounted on PCB test board as described,
only 1 board bending required
±(2%+0.05 ? )
No visible damage
±(1%+0.05 ? )
No visible damage
3mm bending for 0805
2mm bending for 1206/2512
Holding time: minimum 60 seconds
Ohmic value checked during bending
www.yageo.com
Sep 29, 2011 V.2
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